PHOTOSENSITIVE RESIN COMPOSITION

摘要

A photosensitive resin composition which comprises (A) an alkali-soluble polymer, (B) a photopolymerization initiator, and (C) a compound having an ethylenically unsaturated double bond, wherein the photopolymerization initiator (B) is a 2,4,5-triarylimidazole dimer or an acridine compound, while a compound represented by general formula (I) is contained as the compound (C). In general formula (I), R1, R2, A, B, n1, n2 and n3 are each as defined in the description. The photosensitive resin composition is excellently and stably dispersible in a developer to minimize the generation of an aggregate. Further, the resin composition exhibits proper developability and can provide a flexible cured resist with good etching resistance.