LED MODULE DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve heat dissipation characteristics of an LED module device.

SOLUTION: An LED package substrate is in a laminated configuration for which metal foil is attached holding an insulating layer comprising a polyimide resin having a film thickness in the range of 5 μm to 40 μm therebetween onto a metal plate bent to form a planar bottom part having an area sufficient for forming an LED chip mounting part and a pair of the connection parts on its upper surface and wall parts respectively rising from both sides of the bottom part end. An LED package is constituted by mounting an LED chip and filling a transparent resin. The LED package is mounted on a wiring board, a pair of external connection electrodes are connected with wiring of the wiring board, and the planar bottom part back surface of the LED package is fixed to or brought into contact with a heat dissipation body.

COPYRIGHT: (C)2012,JPO&INPIT