| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wafer holder having a spherical curvature, capable of manufacturing it more easily and more precisely than ever before. <P>SOLUTION: A support body 1 has a convex surface 5 in a spherical shape. In a substrate fixing step S21, a substrate 100 is mounted on the surface 5 of the support body 1 and fixed to the support body 1. In a substrate grinding step S22, a surface of the substrate 100 is ground so that the ground surface of the substrate 100 fixed to the support body 1 becomes flat. <P>COPYRIGHT: (C)2012,JPO&INPIT |
