| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad enabling highly accurate finishing requiring extremely high smoothness and flatness, and improving polishing efficiency remarkably superior to the conventional polishing pads. <P>SOLUTION: The polishing pad polishes a workpiece by relatively moving the workpiece while feeding slurry containing a polishing material between the workpiece and the pad. A polishing pad base material is made of an epoxy resin and has hardness of 70-100. <P>COPYRIGHT: (C)2012,JPO&INPIT |
