POWER PACKAGE MODULE

摘要

PROBLEM TO BE SOLVED: To provide a power package module in which a power package and a heat release module are coupled for effectively releasing high heat generated from the power package.

SOLUTION: A power package module includes: a power package 100 on which a number of semiconductor chips are mounted; a heat release module 200 being in contact with the power package 100 and including a first heat release member 210 for releasing the heat generated from the power package 100; and a second heat release member 300 having one end connected through the first heat release member 210 and the other end connected by being inserted through the power package 100.

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