| 摘要 |
The present invention provides a substrate heat treatment apparatus, which is capable of reducing breakage of a configuration member due to heat expansion even at a high temperature, and uniformly heating a substrate at a high speed. One embodiment of the present invention is a substrate heat treatment apparatus for heat-treating a substrate, which is provided with: an outer circumferential ring (4), which can support the substrate; a lift apparatus (20), which has a connection ring (6), and brings up and down the outer circumferential ring (4); balls (12), which have heat conductivity lower than that of the outer circumferential ring (4); and a lamp (11), which heats the substrate supported by the outer circumferential ring (4). The balls (12) are members different from both the outer circumferential ring (4) and the connection ring (6). The lift apparatus (20) brings up and down the outer circumferential ring (4) between a first position close to the lamp (11) and a second position far from the lamp. |
