CLEANING METHOD AND CLEANING APPARATUS

摘要

A cleaning method according to embodiments of the present invention is a cleaning method of cleaning residues from a semiconductor substrate by rotating a roll brush, the method having cleaning residues from the semiconductor substrate while pressing the roll brush against the semiconductor substrate with a first pressure of 7.35 kPa or lower, and cleaning residues from the semiconductor substrate while pressing the roll brush against the semiconductor substrate with a second pressure higher than 7.35 kPa.