| 发明名称 |
PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE |
| 摘要 |
A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
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| 申请公布号 |
US2012161258(A1) |
申请公布日期 |
2012.06.28 |
| 申请号 |
US20100979625 |
申请日期 |
2010.12.28 |
| 申请人 |
LOEPPERT PETER V.;NIEW JEFFERY;MINERVINI ANTHONY;GIESECKE DANIEL |
发明人 |
LOEPPERT PETER V.;NIEW JEFFERY;MINERVINI ANTHONY;GIESECKE DANIEL |
| 分类号 |
H01L29/84 |
主分类号 |
H01L29/84 |
| 代理机构 |
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代理人 |
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| 主权项 |
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