| 摘要 |
PURPOSE: A substrate dividing method is provided to focus laser beams on a focusing point by flatly maintaining the surface of a substrate by etching. CONSTITUTION: A surface of a substrate(1) with a through electrode(4) is removed by an etching process. The upper side(4a) of the through electrode is protruded from the surface of the substrate. A reformation layer(5) is formed on the substrate by focusing laser beams of wavelengths passing through the substrate along a division line. The substrate is divided along the division line by applying external force to the reformation layer. An electrode is protruded after the reformation layer is formed. |
