发明名称 |
REGIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND PRINTED WIRING BOARD |
摘要 |
The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 µm to 3.0 µm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface. |
申请公布号 |
KR20120068834(A) |
申请公布日期 |
2012.06.27 |
申请号 |
KR20127004255 |
申请日期 |
2010.06.25 |
申请人 |
PI R AND D CO., LTD.;MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
NOZAKI MITSURU;NOMOTO AKIHIRO;AKIYAMA NORIKATSU;NAGATA EIJI;YANO MASASHI |
分类号 |
B32B15/088;C25D7/06;H05K1/03;H05K3/38 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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