发明名称 |
Semiconductor light-emitting device and method for manufacturing the same |
摘要 |
A reliable semiconductor light-emitting device and a method for manufacturing the same can be provided in which peeling can be prevented in a phase boundary, and optical axis positional errors between the optical lens and a semiconductor light-emitting chip can be reduced or prevented. The semiconductor light-emitting device can include a base board having at least one chip, a reflector fixed on the base board so as to enclose the chip, and an encapsulating resin disposed in the reflector. An optical lens can include a concave-shaped cavity that has an inner corner surface having a plurality of convex portions thereon. The optical lens can be located adjacent the reflector by contacting the lens with a top surface of the reflector so as to enclose the reflector. A spacer that is disposed between the concave-shaped cavity and the reflector can ease a stress that is generated due to temperature changes. |
申请公布号 |
US8207546(B2) |
申请公布日期 |
2012.06.26 |
申请号 |
US20070747989 |
申请日期 |
2007.05.14 |
申请人 |
HARADA MITSUNORI;SATO MASANORI;STANLEY ELECTRIC CO., LTD. |
发明人 |
HARADA MITSUNORI;SATO MASANORI |
分类号 |
H01L33/12;H01L33/54;H01L33/50;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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