发明名称 |
Semiconductor package heat spreader |
摘要 |
A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate. |
申请公布号 |
US8207598(B2) |
申请公布日期 |
2012.06.26 |
申请号 |
US20090498163 |
申请日期 |
2009.07.06 |
申请人 |
ARARAO VIRGIL COTOCO;SHIM IL KWON;CHOW SENG GUAN;ALVAREZ SHEILA MARIE L.;ST ASSEMBLY TEST SERVICES LTD. |
发明人 |
ARARAO VIRGIL COTOCO;SHIM IL KWON;CHOW SENG GUAN;ALVAREZ SHEILA MARIE L. |
分类号 |
H01L23/36;H01L21/44;H01L21/48;H01L23/367 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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