发明名称 LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD FOR THE SAME
摘要 PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to improve a directional angle of a light source by not arranging a light diffusion unit and a polarization unit on a light guide plate. CONSTITUTION: A circuit board(12) is arranged on a package body(11). A light source(13) is mounted on a circuit board. A conductive wire(14) electrically connects the light source to the circuit board. An optical lens(15) includes a light transmissive resin(151), a light scattering member(152), and a polarization member(153). The polarization member is attached to the optical lens and polarizes incident light from the light source.
申请公布号 KR20120066451(A) 申请公布日期 2012.06.22
申请号 KR20100127801 申请日期 2010.12.14
申请人 SAMSUNG LED CO., LTD. 发明人 KIM, YONG SEOK
分类号 H01L33/58 主分类号 H01L33/58
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