COATING DEVICE, COATING METHOD AND STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a technology which ensures high in-plane uniformity in the thickness of a coating film formed on a substrate by spin coating.

SOLUTION: The in-plane film thickness distribution of a wafer W is determined according to a processing recipe including the type of resist liquid and the transition pattern of the number of revolutions of the wafer W. Coating of the wafer W with resist by using the processing recipe not including irradiation by means of an LED 41 is performed previously, and the in-plane film thickness distribution of the wafer W is determined. A recess 8 in the in-plane film thickness distribution of the wafer W is grasped in advance, and the position of the recess 8 in the film thickness distribution is irradiated by means of the LED 41 and that part on the wafer W is heated locally.

COPYRIGHT: (C)2012,JPO&INPIT