Provided is a laminate of a thermoplastic resin layer and a base, which has excellent transparency and is free from the occurrence of "warping". The laminate is suitable for sealing and surface protection of photoelectric conversion elements. This laminate is obtained by bonding a base and a thermoplastic resin layer that has a thickness larger than 200 µm but 500 µm or less with an adhesive layer being interposed therebetween. The 180° peel strength at 23°C of the thermoplastic resin layer with respect to the adhesive layer is not less than 1.0 N/25 mm. It is preferable that the total light transmittance of the laminate is not less than 80%.
