发明名称 |
METHOD FOR PRODUCING EPITAXIAL SILICON WAFER |
摘要 |
Mirror-polishing a front surface of a silicon wafer using polishing liquid composed of an abrasive grain-free alkaline solution including water-soluble polymers simplifies a polishing process, thus leading to an increase in productivity and a reduction in cost, and reduces the density of LPDs attributable to processing and occurring in the front surface of a mirror-polished wafer, thus improving the surface roughness of the wafer front surface.
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申请公布号 |
US2012156878(A1) |
申请公布日期 |
2012.06.21 |
申请号 |
US201013390764 |
申请日期 |
2010.08.20 |
申请人 |
OGATA SHINICHI;TAKAISHI KAZUSHIGE;NISHIMURA HIRONORI;OKUUCHI SHIGERU;MIKURIYA SHUNSUKE;NAKAYOSHI YUICHI;SUMCO CORPORATION |
发明人 |
OGATA SHINICHI;TAKAISHI KAZUSHIGE;NISHIMURA HIRONORI;OKUUCHI SHIGERU;MIKURIYA SHUNSUKE;NAKAYOSHI YUICHI |
分类号 |
H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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