发明名称 METHOD FOR PRODUCING EPITAXIAL SILICON WAFER
摘要 Mirror-polishing a front surface of a silicon wafer using polishing liquid composed of an abrasive grain-free alkaline solution including water-soluble polymers simplifies a polishing process, thus leading to an increase in productivity and a reduction in cost, and reduces the density of LPDs attributable to processing and occurring in the front surface of a mirror-polished wafer, thus improving the surface roughness of the wafer front surface.
申请公布号 US2012156878(A1) 申请公布日期 2012.06.21
申请号 US201013390764 申请日期 2010.08.20
申请人 OGATA SHINICHI;TAKAISHI KAZUSHIGE;NISHIMURA HIRONORI;OKUUCHI SHIGERU;MIKURIYA SHUNSUKE;NAKAYOSHI YUICHI;SUMCO CORPORATION 发明人 OGATA SHINICHI;TAKAISHI KAZUSHIGE;NISHIMURA HIRONORI;OKUUCHI SHIGERU;MIKURIYA SHUNSUKE;NAKAYOSHI YUICHI
分类号 H01L21/306 主分类号 H01L21/306
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