SUBSTRATE FOR POWER MODULE PACKAGE AND THE METHOD OF MANUFACTURING THEREOF

摘要

PURPOSE: A substrate for a power module package and a manufacturing method thereof are provided to improve operation reliability of a power module by downwardly discharging heat from the power module mounted on the upper side of a substrate through a coating layer. CONSTITUTION: An insulation layer(20) comprises a film formed by anodizing a metal core(10). A seed layer(30) and a plating layer(31) are formed on the upper side of the insulation layer. A circuit(32) is wired on the seed layer and the plating layer. A coating layer(40) is formed by ceramic-coating the lower side of the insulation layer with metal oxide solutions. Organic elements are removed by hardening the coating layer.