| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide metal polishing fluid capable of resolving problems including (a) generation of polishing scratches caused by solid particles, (b) occurrence of deterioration in planarity such as dishing and erosion, (c) complexity of washing process to remove polishing particles remained on a substrate surface after polishing, (d) increase in cost not only for solid abrasive grains themselves but also for the waste liquid processing, and also capable of performing CMP at a high Cu polishing rate, as well as a polishing method for films to be polished using this fluid. <P>SOLUTION: The metal polishing fluid contains metal oxidizing agent, oxidized metal dissolving agent, corrosion-proof agent for metals and water-soluble polymer having anionic functional groups with the weight average molecular weight of 8000 or more, and has pH from 1 to 3. A polishing is performed by relatively moving a polishing surface plate and a substrate having metal film to be polished with the substrate kept pressed onto a polishing cloth, while feeding the metal polishing fluid on the polishing cloth of the polishing surface plate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
