| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable a semiconductor device mounted on an FPC (flexible printed circuit) by using a solder bump to be mounted on a movable part and a bent part of the FPC. <P>SOLUTION: A semiconductor device has: a semiconductor substrate 2 on whose one surface 2a a plurality of electrodes 4 are arranged; an insulation layer 3 arranged so as to cover the one surface 2a of the semiconductor substrate 2 and having a plurality of openings 3b so as to expose the plurality of electrodes 4; a re-wiring layer 5 having one end part electrically connected with the plurality of electrodes 4; a plurality of pads 6 electrically connected with the re-wiring layer 5; and a plurality of solder bumps 7 put on one surface of the plurality of pads 6. One surface 3a of the insulation layer 3 on which the plurality of pads 6 are put is formed so that a cross section seen from an arbitrary direction parallel to the one surface 2a of the semiconductor substrate 2 is in a recessed circular arc shape. <P>COPYRIGHT: (C)2012,JPO&INPIT |
