| 摘要 |
<P>PROBLEM TO BE SOLVED: To minimize a relative position displacement between the bottom layer and the top layer of laminated wiring layers. <P>SOLUTION: A support substrate 10 is prepared in which openings OP1, OP3, OP5 are formed at a peripheral part R2 of a surface on the side of laminating the wiring layers and light irradiation members 20a, 20c, 20e for directing irradiation light from the outside to the openings are provided on a part continued to a side end face. Then, after formation of an insulating layer 34 on the surface on the side where the openings are formed of the support substrate 10, a wiring layer 35 is formed in a region R1 on the inner side of the peripheral part on the insulating layer, and a plurality of alignment marks M1, M3, M5 are formed in a region corresponding to the positions where the openings are formed. When forming a via hole in the insulating layer or the like in the succeeding process, a corresponding alignment mark among the plurality of alignment marks is detected by the light made to pass through the openings by using the light irradiation member, and positioning is performed with the detected mark as a position reference. <P>COPYRIGHT: (C)2012,JPO&INPIT |
