发明名称 LASER MACHINING METHOD AND LASER MACHINING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser cutting machining method and a laser machining device suppressing generation of a recessed part liable to be formed in an inner peripheral surface of an annular hole in a cutting end region when annularly laser-cutting machining a plank. <P>SOLUTION: When oxygen is used as an assist gas, a position reaching an annular path to be annularly cut from a piercing machining position is defined as a position A, a position at a predetermined distance from the position A in the direction of process of cutting machining is defined as a position B, a position at a predetermined distance from the position A in a direction opposite to the direction of process of laser-cutting machining is defined as a position C, in the case that laser-cutting machining is performed from the position A to the position C via the position B, and then laser-cutting machining is performed from the position C to the position B via the position A, laser-cutting machining from the position C to the position B is performed by making laser output small and reducing the cutting speed relative to laser output from the position A to the position C and its cutting speed and laser output is reduced to zero at the position B. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012115899(A) 申请公布日期 2012.06.21
申请号 JP20110127059 申请日期 2011.06.07
申请人 AMADA CO LTD 发明人 MASUDA KENJI
分类号 B23K26/38;B23K26/00;B23K26/14 主分类号 B23K26/38
代理机构 代理人
主权项
地址