发明名称 |
ALUMINUM-DIAMOND COMPOSITE AND METHOD FOR PRODUCING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an aluminum-diamond composite having both high thermal conductivity and a coefficient of thermal expansion near that of a semiconductor element and further improved in surface roughness of a surface and flatness so as to be suitable for use in a heat sink of a semiconductor element or the like. <P>SOLUTION: The aluminum-diamond composite contains an aluminum-diamond composite material which includes metal containing 40-70 vol.% of a diamond particle and the remainder of aluminum, and is formed in a plate with a thickness of 0.4-6 mm or a plate having a recessed and projecting portion. Both main surfaces of the aluminum-diamond composite are coated with an aluminum-ceramic composite with a thickness of 0.05-0.5 mm, and the aluminum-diamond composite has a structure where the aluminum-diamond composite is exposed at a side face and a hole. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012117085(A) |
申请公布日期 |
2012.06.21 |
申请号 |
JP20100265088 |
申请日期 |
2010.11.29 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
HIROTSURU HIDEKI;TSUKAMOTO HIDEO;ISHIHARA YOSUKE |
分类号 |
C22C1/10;B22D19/00;C22C1/05;C22C21/00;C22C26/00;C22C29/18;C23C18/18;C25D5/44;C25D7/12;H01L23/373 |
主分类号 |
C22C1/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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