发明名称 |
IC DEVICE HAVING ELECTROMIGRATION RESISTANT FEED LINE STRUCTURES |
摘要 |
An integrated circuit (IC) device includes an electromigration resistant feed line. The IC device includes a substrate including active circuitry. A back end of the line (BEOL) metallization stack includes an interconnect metal layer that is coupled to a bond pad by the EM resistant feed line. A bonding feature is on the bond pad. The feed line includes a uniform portion and patterned trace portion that extends to the bond pad which includes at least three sub-traces that are electrically in parallel. The sub-traces are sized so that a number of squares associated with each of the sub-traces are within a range of a mean number of squares for the sub-traces plus or minus twenty percent or a current density provided to the bonding feature through each sub-trace is within a range of a mean current density provided to the bonding feature plus or minus twenty percent.
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申请公布号 |
US2012153458(A1) |
申请公布日期 |
2012.06.21 |
申请号 |
US20100970464 |
申请日期 |
2010.12.16 |
申请人 |
HOWARD GREGORY ERIC;THOMPSON PATRICK;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
HOWARD GREGORY ERIC;THOMPSON PATRICK |
分类号 |
H01L23/488;H01L21/768 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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