发明名称 |
LED package |
摘要 |
The present invention relates to an optical semiconductor device including: a substrate (1) having mounted thereon an LED chip; an encapsulation resin layer (2) embedding the LED chip; an inorganic high-heat conductive layer (3); and a wavelength conversion layer (4) containing an inorganic phosphor powder, in which the encapsulation resin layer (2), the inorganic high-heat conductive layer (3) and the wavelength conversion layer (4) are laminated in this order on the substrate either directly or indirectly. |
申请公布号 |
EP2466657(A2) |
申请公布日期 |
2012.06.20 |
申请号 |
EP20110193382 |
申请日期 |
2011.12.14 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
OZAKI, TAKASHI;KONDO, TAKASHI;AKAZAWA, KOJI |
分类号 |
H01L33/50;H01L33/48;H01L33/56;H01L33/64 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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