| 摘要 |
An annealing apparatus includes heating sources 17a and 17b provided to face a wafer W, the heating sources 17a and 17b having LEDs 33 emitting lights to the wafer; light-transmitting members 18a and 18b for transmitting the lights emitted from the LEDs 33; and cooling members 4a and 4b made of aluminum and provided to directly contact with the heating sources 17a and 17b, respectively. The heating sources 17a and 17b include a plurality of LED arrays having supporters 32 made of AlN, each having one surface on which the LEDs 33 are adhered by using a silver paste 56; and other surface on which thermal diffusion members 50 made of copper are adhered by using a solder 57. The LED arrays 34 are fixed to the cooling member 4a(4b) by using screws via a silicon grease. |
