METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME

摘要

PURPOSE: A method for fabricating a semiconductor device and a semiconductor device fabricated by the same are provided to prevent the disconnection of a wire by electrically connecting a plurality of semiconductor stacked structures to lead electrodes. CONSTITUTION: A member(50) has a first lead electrode(53a) and a second lead electrode(53b). A semiconductor stacked structure(30) is arranged on the member. The semiconductor laminate structure has a first conductive semiconductor layer, a second conductive semiconductor layer, and an active region. The active region is interposed between the first conductive semiconductor layer and the second conductive semiconductor layer. A plating layer combines the semiconductor stacked structure with the member.