| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device enabling a burn-in in a state of a tape carrier, while not hindering further miniaturization, densification, increase of the number of pins and so on of a wiring pattern or a connection pad, not giving a bad influence on a signal current flowing through a wiring pattern in electrical characteristics, and not requiring a troublesome work such as stamping out of electrodes. <P>SOLUTION: In the tape carrier for a semiconductor device, a blind via 22a and a reinforcement copper layer 20 as a peelable layer are used as a conductor for supplying an electroplating current, a gold/nickel electroplated layer 24 is formed on a surface of at least one of a wiring pattern 12 and a connection pad 13 by electroplating, and the reinforcement copper layer 20 is peeled off after completion of the electroplating process. <P>COPYRIGHT: (C)2012,JPO&INPIT |
