| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device capable of: suppressing a short circuit between semiconductor device bonding bumps and between the semiconductor device bonding bump and a wiring; and facilitating pitch miniaturization. <P>SOLUTION: A tape carrier for a semiconductor device comprises an insulating substrate 10 having a first principal surface S1 on which a wiring 21 is formed and a second principal surface S2 on which a plurality of semiconductor device bonding bumps 31 are formed. Each semiconductor device bonding bump 31 is disposed independently in a dispersed state on the second principal surface S2 and is electrically connected to the wiring 21 on the first principal surface S1 through a via 12 which pierces the insulating substrate 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
