| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate in which an electronic component can be mounted on an external electrode formed on a via. <P>SOLUTION: A ceramic multilayer substrate 1 having a via filled with a conductive paste is characterized in that the outermost portion (a first via 3a) of a via 3 is formed of a conductive paste containing no glass components. Thus, the ceramic multilayer substrate in which an electronic component can be mounted on an external electrode formed on the via can be provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
