| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem of possible reduction of adhesiveness between a wiring conductor and a lead terminal, because of a reduced junction area between the wiring conductor and the lead terminal according to the required miniaturization of the wiring conductor accompanying the miniaturization of an electronic component housing package for mounting an electronic component. <P>SOLUTION: An electronic component housing package 1 includes: a branch portion 15, having a plurality of branches, in which at least one of a plurality of lead terminals 11 is positioned at one end portion side; and a junction portion 17 positioned nearer to another end portion side than the branch portion 15, and joined to a wiring conductor 9 through a junction member 13. The junction member 13 is joined to the lower surface, facing the wiring conductor 9, in the junction portion 17 of a lead terminal 11a, and to an inside face 15a of a branch portion in the plurality of branch portions 15 of the lead terminal 11a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
