| 摘要 |
<P>PROBLEM TO BE SOLVED: To develop and provide a heat dissipating grease composition that has higher thermal conductivity than conventional products and is in a semisolid state and easy to apply. <P>SOLUTION: The heat dissipating grease composition is provided, which contains a substrate comprising metal that includes gallium (Ga), indium (In) and/or tin (Sn) and has a melting point under normal pressure of 16°C or less, and a fine powdered filler comprising metal uniformly dispersed in the substrate, and which has consistency in the range of 200-400. <P>COPYRIGHT: (C)2012,JPO&INPIT |
