| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solution type composition for forming a copper film, having a favorable coating property, having high preservation stability, convertible into the copper film at low temperatures, and capable of economically manufacturing the copper film that exhibits high conductivity. <P>SOLUTION: As an essential component, the composition for copper film forming contains 1 mol part of copper formate or hydrate thereof, 0.25-2.0 mol parts of at least one type of diol compound selected from a group consisting of diol compounds expressed either by the general formula (1) or by the general formula (1'), 0.25-2.0 mol parts of piperidine compound expressed by the general formula (2), and an organic solvent dissolving them. <P>COPYRIGHT: (C)2012,JPO&INPIT |
