发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER |
摘要 |
A method for manufacturing semiconductor wafer is provided, which includes: heating, so as to dissolve metal material into semiconductor material of the wafer, thereby forming a semiconductor-metal compound; and cooling, so as to inversely melt said semiconductor-metal compound, thereby forming a metal/semiconductor mixture. Said manufacturing method can obtain high-purity wafer which is suitable for semiconductor manufacturing process. |
申请公布号 |
WO2012075735(A1) |
申请公布日期 |
2012.06.14 |
申请号 |
WO2011CN71303 |
申请日期 |
2011.02.25 |
申请人 |
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OFSCIENCES;ZHONG, HUICAI;LIANG, QINGQING;ZHAO, CHAO |
发明人 |
ZHONG, HUICAI;LIANG, QINGQING;ZHAO, CHAO |
分类号 |
H01L31/18;H01L21/322 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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