摘要 |
An imprint (100) apparatus which cures a resin (7) dispensed on a substrate (1) while the resin (7) and a pattern surface (PS) of a mold (2) are in contact with each other, comprises a supply portion (16) configured to supply a gas, used to accelerate filling of a concave portion (6) of the pattern surface (PS) of the mold (2) with the resin (7), to a space which the pattern surface (PS) of the mold (2) faces, and a controller (CNT) configured to control the supply portion (16) to supply the gas to the space before the resin (7) and the pattern surface (PS) of the mold (2) are brought into contact with each other, wherein the supply portion (16) is configured to supply the gas to the space via a porous portion (8) formed in at least part of the mold (2). |