| 摘要 |
PURPOSE: A cutting apparatus is provided to prevent a cut chip from being attached to the wall of a cutting groove by ultrasonically vibrating a vibration plate using an ultrasonic wave generating unit. CONSTITUTION: A chuck table(3) maintains a semiconductor wafer(10). A cutting blade(43) cuts a work piece on the chuck table. A rotation spindle(42) is rotatably supported in a spindle housing. A cutting water feeding unit includes a first nozzle(531) and a second nozzle(532). An ultrasonic vibrator(62) gives ultrasonic vibration to a vibration plate(61). |
