发明名称 |
Mounting apparatus and mounting method |
摘要 |
There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer. The mounting apparatus 10 sticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table 11. The mounting apparatus 10 includes a pre-cut means 13 for forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking means 34 for peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF. |
申请公布号 |
US8196632(B2) |
申请公布日期 |
2012.06.12 |
申请号 |
US20040574847 |
申请日期 |
2004.09.29 |
申请人 |
TSUJIMOTO MASAKI;KOBAYASHI KENJI;YOSHIOKA TAKAHISA;LINTEC CORPORATION |
发明人 |
TSUJIMOTO MASAKI;KOBAYASHI KENJI;YOSHIOKA TAKAHISA |
分类号 |
B29C65/00;B32B37/00;B32B38/04;B32B38/10;H01L21/00;H01L21/301;H01L21/68 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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