| 摘要 |
PURPOSE: An inspection apparatus which includes a large-area high-speed detection module is provided to acquire a wafer image with high speed in a line scan mode by arranging area scan cameras into a single line. CONSTITUTION: A detection part(100) is comprised of a plurality of image sensors(120) and a plurality of optical systems(110). A stage(210) transfers a wafer. A trigger pulse generation part(200) creates a trigger signal for controlling a lighting part(220). An image separator(300) separates an image acquired by the detection part into a plurality of images. A master terminal detects wafer defects by collecting processed imaged from a plurality of terminals(310).
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