Adhesive composition directly applicable on the rear surface of semiconductor wafer

摘要

PURPOSE: An adhesive composition is provided to be able to be spread on backside of a semiconductor water directly, to have remarkably excellent reliability in packages of various kinds, and to provide a paste-type product with dimensional stability capable of obtaining excellent properties in multilayer type multichip package. CONSTITUTION: An adhesive composition for chip(die) comprises 6-25 weight% of an ultrahigh molecular-weight acrylic resin with the weight average molecular weight of 100,000-1,000,000 based on 100weight% of the adhesive composition; 0.5-9 weight% of epoxy resin; 0.5-4 weight% of a phenol resin; 0.3-5 weight% of filler; 0.01-0.2 weight% of an adhesion improver; and 70-85 weight% of a solvent. The ultrahigh molecular-weight acrylic resin is obtained by suspension polymerization of one or more polymers selected from acrylonitrile monomer, 2-ethylhexylacrylate, 2-ethylhexylmethacrylate, butylacrylate, ethylacrylate, isobutylacrylate, and 2-hydroxyethylacrylate.