| 摘要 |
<p>PURPOSE: A semiconductor package is provided to efficiently emit heat generated from a semiconductor package by exposing or projecting a shape memory structure to a side of an encapsulating material. CONSTITUTION: A first semiconductor chip(210) is mounted on an upper portion of a substrate(100). An encapsulating material molds the first semiconductor chip. Shape memory structures(410-450) are inserted into the encapsulating material. A second semiconductor chip(220) is laminated on an upper portion of the first semiconductor chip. The substrate is electrically connected to an through electrode(212) of the first semiconductor chip through a solder bump(105). The through electrode of the first semiconductor chip is electrically connected to an through electrode(222) of the second semiconductor chip.</p> |
