Substrate bonding apparatus and method of bonding the substrate

摘要

PURPOSE: A substrate bonding apparatus and a bonding method thereof are provided to minimize the generation of particles by separately forming a rotating area and a bonding area of a substrate. CONSTITUTION: A second chamber(200) forms a bonding space while being combining with a first chamber(100). A moving part(300) vertically and horizontally moves a second chamber. A rotating part(400) rotates the second chamber. A first substrate and a second substrate are bonded in a bonding area(1000). The second chamber revolves in a rotation area(2000).