发明名称 Light emitting diode and method for fabricating the light emitting device
摘要 PURPOSE: A light emitting diode and a fabricating method thereof are provided to reduce the lattice mismatch of a material and the difference of thermal expansion coefficients by forming a buffer layer between a light emitting structure and a substrate. CONSTITUTION: A light emitting structure is formed on the top of a substrate. The light emitting structure includes a first conductive semiconductor layer(122), an active layer, and a second conductive semiconductor layer(126). An uneven portion is formed on a side(201) of the light emitting structure. A first electrode(190) is formed on at least a part of the first conductive semiconductor layer. A second electrode(200) is formed on at least a part of the second conductive semiconductor layer.
申请公布号 KR20120059859(A) 申请公布日期 2012.06.11
申请号 KR20100121342 申请日期 2010.12.01
申请人 LG ELECTRONICS INC. 发明人 JEON, JI NA
分类号 H01L33/22 主分类号 H01L33/22
代理机构 代理人
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