| 摘要 |
The method involves putting a module (16) comprising a microcircuit (14) into place in a cavity (20), and depositing an adhesive strip (38) on a surface (16I) of the module that is designed to face a bottom (24) of the cavity before putting the module in the cavity. The strip is allowed to enable the module to adhere to the bottom of the cavity and limit a deformation stroke of the module that occurs under the effect of a mechanical compression force so as to urge the module against the bottom of the cavity. The strip is made of a heat-activatable adhesive material. An independent claim is also included for a microcircuit device comprising a body.. |
