| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition capable of forming a cured film having favorable adhesiveness to a polyimide film or copper substrate and excellent in flexibility. <P>SOLUTION: There is provided a curable composition containing a compound (A) represented by formula (1) and a compound (B) represented by formula (2) (wherein R<SP POS="POST">1</SP>, R<SP POS="POST">2</SP>and R<SP POS="POST">3</SP>are each independently a 1-100C organic group; R<SP POS="POST">4</SP>and R<SP POS="POST">6</SP>are each independently hydrogen or a methyl group; and R<SP POS="POST">5</SP>is a 1-100C organic group). <P>COPYRIGHT: (C)2012,JPO&INPIT |
