发明名称 INFRARED SENSOR PACKAGE AND ELECTRONIC DEVICE EQUIPPED THEREWITH
摘要 An infrared sensor package includes a housing member, which includes an upper-surface section provided with a transmission member which transmits infrared radiation and a lower-surface section and whose inner space is vacuum-sealed, a plate-like heater member which is disposed within the inner space of the housing member and generates heat, an infrared detection element which is fixed onto the heater member and detects the infrared radiation which is transmitted by the transmission member, and a heat-insulating member which has a low thermal conductivity and a smaller cross-sectional area than that of the heater member, and supports the heater member while being fixed onto the lower-surface section.
申请公布号 US2012138803(A1) 申请公布日期 2012.06.07
申请号 US201113311678 申请日期 2011.12.06
申请人 YAMAZAKI TAKAO;KATO KOJI;SASAKI TOKUHITO 发明人 YAMAZAKI TAKAO;KATO KOJI;SASAKI TOKUHITO
分类号 G01J5/02 主分类号 G01J5/02
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