发明名称 |
SYSTEM TO IMPROVE CORELESS PACKAGE CONNECTIONS AND ASSOCIATED METHODS |
摘要 |
A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance. |
申请公布号 |
US2012138349(A1) |
申请公布日期 |
2012.06.07 |
申请号 |
US201213369273 |
申请日期 |
2012.02.08 |
申请人 |
HARVEY PAUL M.;O'REILLY COLM B.;YANG SAMUEL W.;ZHOU YAPING;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HARVEY PAUL M.;O'REILLY COLM B.;YANG SAMUEL W.;ZHOU YAPING |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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