| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component storage package and a mounting structure excellent in reliability for heating of an electronic component. <P>SOLUTION: An electronic component storage package 2 comprises: a base plate 5 having an electronic component mounting region R thereon; a base body 6 provided on the base plate 5 along an outer periphery of the electronic component mounting region R, and having an attaching part M positioned above a top surface of the base plate 5; an optical fiber holding member 7 provided in the attaching part M, extending a region having an overlap with the base plate 5 to a region having no overlap with the base plate 5 in plan view, having a through-hole T in a planar direction, and including an abutting portion 8 abutted to the top surface of the base plate 5 inside the base body 6 in plan view. A mounting structure 1 comprises: an electronic component 3 mounted in the electronic component mounting region R of the electronic component storage package 2; and a lid body 4 provided on the electronic component storage package 2, for covering the electronic component 3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
