发明名称 SUBSTRATE HOLDER, SUBSTRATE BONDING DEVICE, METHOD OF MANUFACTURING STACKED SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent failure of a substrate bonding device by managing the identification information of a substrate holder. <P>SOLUTION: The substrate bonding device which bonds a plurality of substrates comprises a plurality of substrate holders which hold a plurality of substrates, respectively, and are assigned with unique identification information, a section which bonds the plurality of substrates held by the plurality of substrate holders, a recognition section which recognizes the identification information assigned to the plurality of substrate holders, and an output section which outputs the fact when the identification information recognized by the recognition section is duplicated. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012109319(A) 申请公布日期 2012.06.07
申请号 JP20100255315 申请日期 2010.11.15
申请人 NIKON CORP 发明人 KITO YOSHIAKI;KURATA NAOHIKO
分类号 H01L21/02;H01L21/673 主分类号 H01L21/02
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