| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of fine pin pitch without causing a pin movement problem, by which the number of manufacturing steps can be reduced, and to provide a manufacturing method for the same. <P>SOLUTION: A printed circuit board 100 according to the present invention includes a base substrate 110 including a connection pad 111, a lead pin 200 bonded to the connection pad 111, and surface treatment layers 301 and 303 formed in portions where the connection pad 111 and the lead pin 200 are exposed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
