| 摘要 |
A large range of commercial VLSI Deep Submicron circuits are used in aeronautics for designs of electronic cards. Due to miniaturization, a continually increasing level of integration and the use of new materials in the foundries, the main failure mechanisms change whilst other ones appear. The lifetimes linked to these failure mechanisms are suspected of being shorter and shorter, so that predicting the lifetime becomes a significant challenge for the reliability of Deep Submicron (DSM) semiconductors. A new approach is proposed here, based on analyzing the technology so as to determine the potential risks to reliability with respect to the specific use of DSM components for avionics applications. |
