| 摘要 |
<p>The purpose of the present invention is to provide a cooling apparatus for electronic components that can sufficiently increase cooling efficiency for electronic components and also provide a method for manufacturing the same. According to this cooling apparatus for electronic components (100), a metal pipe (50), metal foil (20) disposed on the external surface of the metal pipe (50), heat cured resin layers (10) adhering with the external surface of the metal pipe (50) and the metal foil (20) are provided; therefore, thermal contact can be made with a sufficiently small number of voids between the electronic components and the metal pipe (50) in a state having an electrical insulating function, and cooling efficiency for electronic components can be increased.</p> |
